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Cornell University

Cornell has a long tradition of leadership in innovative and impactful efforts to advance the science and technology of semiconductors and materials, partnering with industry and the wider research community. The recent passage of the CHIPS and Science act is leading to even more vigorous engagement and new opportunities to collaborate, advance research and development, and train the next generation of scientists and semiconductor workforce. 

This site serves as a reference point for the research community and a source of information about opportunities and connections across Cornell and beyond.

Opportunities

SponsorTitleLinksDates
FuzeHub2024 Microelectronics Innovation Challenge (limited submission)FuzeHub webpage
Cornell Limited Submission Announcement (internal – requires NetID login)
Cornell internal submission deadline 11/18/24 5 PM ET
U.S. Department of Commerce (DOC), National
Institute of Standards and Technology (NIST)
CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and
Processes (CARISSMA)
DOC Press Release
NOFO
Informational Webinar 11/8/24
Proposers’ Day Meeting 11/15/24
Concept papers due 1/13/25
National Science Foundation (NSF)/Manufacturing USABioMADE Project Call 5NSF Announcement
Project Call
Project Call Launch 11/13/24
National Science Foundation (NSF)Quantum Leap Challenge Institutes (QLCI)NSF Program SolicitationLetter of Intent due 2/7/25
Preliminary proposal due 3/7/25
Full proposal due 9/17/25 by invitation only
Natcast/NSTCTest Vehicle innovation pipeline (TVIP)https://natcast.org/research-and-development/tvipCall for Proposals
8/28/24
Proposers’ Day in D.C.
9/10/24
Concept papers due 9/16/24
Full proposals due
10/21/24
National Science Foundation (NSF) https://new.nsf.gov/chips#funding 
National Institute of Standards and Technology (NIST) https://www.nist.gov/chips 
Natcast/NSTChttps://events.sa-meetings.com/website/78469/
https://natcast.org/research-and-development/tvip

Requests for Information

SponsorTitleLinkDates
None at this time.   

 

Awards and Impact

A Cornell-led collaboration has developed the first dual-sided – or “dualtronic” – semiconductor that combines photonic and electronic functions simultaneously.

September 25, 2024

A unique project team enables Cornell undergraduates to use emerging open-source hardware to design, test and fabricate their own microchips – a complex, expensive process that is rarely available to students.

May 6, 2024

The Cornell NanoScale Science and Technology Facility has partnered with two academic institutions to offer a free Microelectronics and Nanomanufacturing Certificate Program to veterans and their dependents.

April 15, 2024

Researchers developed a semiconductor chip that will enable ever-smaller devices to operate at the higher frequencies needed for future 6G communication technology.

March 6, 2024

A two-week program that introduces high school seniors to nanofabrication is one of many efforts at the Cornell NanoScale Facility to prepare a workforce – as the microchip industry settles in upstate New York.

January 31, 2024

Site visits by representatives from the Office of the Under Secretary of Defense for Research & Engineering, Naval Surface Warfare Center and the National Security Technology Accelerator will connect with the Microelectronics Commons Hubs, local government leaders, and experts from industry and academia to accelerate the prototyping of advanced microchips that will bolster our nation’s military technological advantage.

January 19, 2024

Events

Abstract: Technology roadmaps for superconductor electronics (SCE) and quantum computing are under development within the framework of the International Roadmap for Devices and Systems (IRDS). Advanced fabrication processes are needed to allow SCE to achieve its potential. The most complex digital superconductor electronic circuit made to date has only a little over one million Josephson junctions, the switching elements at the heart of most SCE logic. Much larger circuit complexities are required to meet the demands of applications such as quantum computing support, machine learning, or large-scale digital computing. Key fabrication needs include materials with processing temperatures compatible with CMOS back end of line (BEOL), superconductor materials with higher critical temperatures, capacitors, smaller dimensions, more wiring layers, and junctions that are scalable to smaller dimensions or have different behaviors. Work towards development of a suitable fabrication stackup is presented with a focus on areas of greatest need.