News
Cornell scientists have developed a novel technique to transform symmetrical semiconductor particles into intricately twisted, spiral structures – or “chiral” materials – producing films with extraordinary light-bending properties.
The Brooks Tech Policy Institute has received $3 million from the Department of Defense to establish the U.S. Semiconductor Research Hub, which will assess and improve the resilience of the global network of semiconductor infrastructure.
A Cornell-led collaboration has developed the first dual-sided – or “dualtronic” – semiconductor that combines photonic and electronic functions simultaneously.
A unique project team enables Cornell undergraduates to use emerging open-source hardware to design, test and fabricate their own microchips – a complex, expensive process that is rarely available to students.
The Cornell NanoScale Science and Technology Facility has partnered with two academic institutions to offer a free Microelectronics and Nanomanufacturing Certificate Program to veterans and their dependents.
Researchers developed a semiconductor chip that will enable ever-smaller devices to operate at the higher frequencies needed for future 6G communication technology.
A two-week program that introduces high school seniors to nanofabrication is one of many efforts at the Cornell NanoScale Facility to prepare a workforce – as the microchip industry settles in upstate New York.
Site visits by representatives from the Office of the Under Secretary of Defense for Research & Engineering, Naval Surface Warfare Center and the National Security Technology Accelerator will connect with the Microelectronics Commons Hubs, local government leaders, and experts from industry and academia to accelerate the prototyping of advanced microchips that will bolster our nation’s military technological advantage.
A consortium organized by Cornell and four other New York-based leaders in semiconductor research and development has been awarded $40 million by the U.S. Department of Defense to advance microelectronics innovation and manufacturing.
Cornell researchers are part of a project to enable sustainable hardware for AI and quantum computing, one of 11 projects selected by DOE to receive a total of $73 million.
Under the CHIPS and Science Act, the Defense Department today announced the award of nearly $240 million dollars to eight regional “innovation hubs” around the United States which will be a part of the Microelectronics Commons, and which will benefit both the department and the United States by spurring development of a domestic microelectronics manufacturing industry.
The U.S. National Science Foundation today announced 24 research and education projects with a total investment of $45.6 million — including funding from the “CHIPS and Science Act of 2022” — to enable rapid progress in new semiconductor technologies and manufacturing as well as workforce development. The projects are supported by the NSF Future of Semiconductors (FuSe) program through a public-private partnership spanning NSF and four companies: Ericsson, IBM, Intel and Samsung. “Our investment will help train the next generation of talent necessary to fill key openings in the semiconductor industry and grow our economy from the middle out and bottom up,” said NSF Director Sethuraman Panchanathan. “By supporting novel, transdisciplinary research, we will enable breakthroughs in semiconductors and microelectronics and address the national need for a reliable, secure supply of innovative semiconductor technologies, systems and professionals.” Read the full story here: https://new.nsf.gov/news/nsf-partners-invest-45-million-future