Cornell University hosted the 2025 SUPREME annual review, bringing together academia, industry, and government to advance next-generation semiconductor innovation and workforce development.

Nearly a decade after they first demonstrated that soft materials could guide the formation of superconductors, Cornell researchers have achieved a one-step, 3D printing method that produces superconductors with record properties.

The Cornell NanoScale Science and Technology Facility has launched a free VR youth outreach module, designed to prepare the next generation of students in cutting-edge microchip fabrication.

The NSF, in partnership with Intel, will invest $20 million over five years to establish the Artificial Intelligence Materials Institute at Cornell, as part of the National Artificial Intelligence Research Institutes.

Cornell researchers have uncovered a microscopic layer of carbon contamination, often left behind by air exposure and fabrication techniques, that impairs electrical flow in devices made with gallium oxide. They also found a solution.

Gallox Semiconductors, a startup with Cornell Roots, won the 2025 Hello Tomorrow Global Challenge in the Advanced Computing & Electronics category. A member of the Praxis Center for Venture Development, Gallox is one of several semiconductor startups launched at Cornell.

The Cornell Systems Engineering M.Eng. program has developed the Semiconductor, Manufacturing, and Industrial (SEMI) Engineering pathway that features specialized courses for the semiconductor industry, as well as leading-edge approaches in operations, controls, planning and optimization.

Cornell scientists have developed a novel technique to transform symmetrical semiconductor particles into intricately twisted, spiral structures – or “chiral” materials – producing films with extraordinary light-bending properties.

The Brooks Tech Policy Institute has received $3 million from the Department of Defense to establish the U.S. Semiconductor Research Hub, which will assess and improve the resilience of the global network of semiconductor infrastructure.

A Cornell-led collaboration has developed the first dual-sided – or “dualtronic” – semiconductor that combines photonic and electronic functions simultaneously.

A unique project team enables Cornell undergraduates to use emerging open-source hardware to design, test and fabricate their own microchips – a complex, expensive process that is rarely available to students.